GWT's Assembly capabilities -Tolerances

GWT's Assembly capabilities -Tolerances

GWT’s Pick and Place machines guarantee a mounting accuracy of ±0.04mm for passive parts, and as low as ±0.03mm for ICs such as BGA and QFN parts. These extremely high placement accuracy ratings allow us to offer high-quality assembly for parts with pitch as low as 0.4mm. 

For irregular SMT parts that are neither passive chip-style packages—0603, 0402, 0201, etc.—or multi-pin ICs such as BGA, QFN, or QFP, the rating of ±0.04mm mounting accuracy still applies. In fact, GWT’s Pick and Place machines can handle nearly any type of surface-mounted device, so long as it has a package height between 0.1mm and 6.0mm. Any packages with physical height outside this range must be installed using Manual Soldering.

PCBs should have minimum dimensions of 5.0 x 5.0mm (0.2 x 0.2 inch), up to a maximum of 600 x 400mm (23.6x 15.7inch) to accommodate GWT’s Pick and Place machines. It is possible to provide automated assembly for smaller boards, but this will require additional cost and lead time in order to design and build the proper supports and fixtures to allow for part placement.

A summary of the specifications discussed above is provided in the following table: