DFA guidelines
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DFA guidelines for component footprint
DFA guidelines for component footprintComponent footprintThe pads and the size of the footprint should be as per the component manufacturer's datasheet.Here,The pin pitch,the hole sizes,the pad sizes,...
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DFA guidelines for soldermask clearances
DFA guidelines for soldermask clearancesSoldermask clearance is a permitted dimensional varation that decides how close the soldermask can be placed to the board surface features(Copper traces).The pu...
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DFA guidelines for Component spacing
DFA guidelines for Component spacingPart-to-part spacingThe land pattern spacing for all component packages will impact the cumulative timeline and reliability requirements for PCB assembly.For exampl...
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DFA guidelines for EMI and EMC considerations
DFA guidelines for EMI and EMC considerationsEMI and EMC considerationsImproperly designed PCBs might get affected by radiated electromagnetic energy called EMI (electromagnetic interference).To preve...
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DFA guidelines for part-to-edge-spacing
DFA guidelines for part-to-edge-spacingThe distance between the component on the board and the board edge is an important aspect to consider for the depanelization process.During the depanelization pr...
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DFA guidelines for Part-to-hole spacing
DFA guidelines for Part-to-hole spacingPart-to-hole spacing is needed for both through-hole parts and microvias.This requirement decides the minimum spacing between a component body/pad and eigher of ...
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DFA guidelines for Component clearance
DFA guidelines for Component clearanceThe maximum component boundary is the component's outermost perimeter including the edge of the package and lead ends.The minimum pavement courtyard is specified ...
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DFA guidelines for Component orientation
DFA guidelines for Component orientationNote:Poor component placement(on the right)and good component placement(on the left)Align similar components in the same direction.This helps in effective routi...
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DFA best practices
DFA best practices1.opt for readily available components and ensure that they will be manufactured in the future.This will avoid future production delays.2.Adhere to component spacing guidelines.Compo...
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What is DFT?
What is DFT?DFT is also called Design for testing,Is an integral part of electronic production.Provisions must be made on the circuit board in the design phase itself.Usually,Test points are provided ...
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Through-hole assembly design considerations.
Through-hole assembly design considerations.*Differentiate axial lead from radial lead components:Through-hole components are available in two types:axial lead and radial lead.In axial ones,the compon...
