CCL-Copper Clad Laminate

Copper Clad Laminate-CCL

Copper Clad Laminate (CCL) in rigid boards, also called PCB laminate, is a type of substrate material of printed circuit boards with a thin layer of copper laminated on either one side or both sides, and we call it as single-sided CCL or double-sided CCL. In rigid PCB production, manufacturers use rigid CCLs with substrate material, like resin epoxy (FR4), metal core (alu or copper), PTFE and Ceramic, to fabricate single-, double- and multi-layer circuit boards.

Resin Epoxy FR-4 CCL 

FR-4 (or FR4) copper clad laminate (CCL) is a rigid PCB substrate material with copper clad on either one side or both sides of FR4 base, which is a composite material composed of woven fiberglass cloth with an epoxy resin binder that is flame resistant. FR stands for flame retardant, and does not denote that the material complies with the standard UL 94V-0 unless testing is performed to UL 94, Vertical Flame testing in Section 8 at a compliant lab. The designation FR-4 was created by NEMA (National Electrical Manufacturers Association) in 1968.

Properties of FR-4 CCL: 

--Low Glass Transition Temperature (Tg) (Tg130 oC – Tg140 oC)

--Mid Glass Transition Temperature (Tg) (Tg150 oC)

--High Glass Transition Temperature (Tg) (Tg170oC)

--High Decomposition Temperature (Td) (Td>345oC)

--Dielectric Constant (Dk or Er) (@1GHz): 3.66-4.5

--Dissipation Factor (Df) (@1GHz): 0.016

--High UL Rated Flammability: 94V-0

--Low Coefficient of Thermal Expansion (CTE) (2.5%-3.8%)

--High Comparative Tracking Index (CTI): (CTI >=600V)

--Halogen-free

--Compatible with standard and lead-free assembly

--FR4 CCL thickness available from 0.2mm to 3.2mm

--Copper thickness available form 1/3oz to 3oz

Copper Core CCL

Similar to Aluminum Core CCL, Copper Core CCL is made of copper plate, dielectric bonding layer and copper foil. The thermal conductivity is mainly decided by the bonding dielectric layer and whether your board has thermal dissipation design.

Copper Core PCB, also referred to copper substrate PCB, copper based PCB or copper clad PCB, which has 3 main design types:

--Common copper core PCB: (with circuitry on copper layer without PTH)

--Chip on Board (COB) copper PCB

--Direct thermal path copper-based PCB (no insulator under the thermal path pad)

Properties of Copper Core CCL: 

--Thermal Conductivity: 3.0W/m·K, 5.0W/m·K, 7.0W/m·K

--Copper (Cu) Style: C1100 (386 W/m·K)

--Copper thickness available from 0.5oz to 2oz

--Glass Transition Temperature (Tg): Tg100oC, Tg120oC, Tg130oC

--Dielectric Constant (Dk or Er) (@1MHz): 4.8

--Halogen-free

--Compatible with standard and lead-free assembly

--High UL Rated Flammability: 94V-0

--Copper Core CCL thickness available from 0.8mm to 2.0mm

Aluminum Core CCL

Aluminum (Aluminium or Alu) core or Aluminum base copper clad laminate (CCL) is made of aluminum plate, dielectric bonding layer and copper foil by high temperature and hot pressing. The metal layers are with high thermal conductivity, while the overall conductivity of the Aluminum core laminate is decided by the dielectric bonding layer. With high thermal conductivity, the dielectric may be filled with ceramic.

Most aluminum PCB boards are built with single-sided CCL, while double-sided CCL for double-sided Aluminum PCB and multilayer hybrid Aluminum PCB manufacturing are possible at GWT.

Properties of Aluminum Core CCL:

 1.Thermal Conductivity: 1.0W/m·K, 1.5W/m·K, 2.0W/m·K, 3.0W/m·K, 4.2W/m·K, 5.0W/m·K, 7.0W/m·K

2.Aluminum (Al) Alloy Style: 1060 (138 W/m·K) and 5052 (220 W/m·K)

3.Copper (Cu) Style: C1100 (386 W/m·K)

4.Copper thickness available from 0.5oz to 2oz

5.Glass Transition Temperature (Tg): Tg100oC, Tg120oC, Tg130oC

6.Dielectric Constant (Dk or Er) (@1MHz): 4.8

7.Halogen-free

8.Compatible with standard and lead-free assembly

9.High UL Rated Flammability: 94V-0

10.Aluminum Core CCL thickness available from 0.8mm to 2.0mm