PCB manufacturing

PCB manufacturing

As a buyer or design engineer, your challenge is to find high quality, competitively priced printed circuit boards and interconnect solutions for your end product. GWT has rich experiences in PCB technology, design optimization, and manufacturability, GWT'S dedicated team of PCB professionals will provide you with the most innovative and cost-effective solutions for your front-end design through mass production.

1.Competitive Prices

Our experienced team of PCB professionals works closely with state-of-the-art manufacturing partners to offer the most competitive prices in the market while ensuring that all boards are built to global quality standards. With extensive knowledge of industry requirements and specifications,The GWT PCB team will also assist with design and engineering specifications to improve manufacturability and help identify cost reduction opportunities.

From the moment you contact us about a new or existing project up to the time we deliver, our focus will remain on providing the best quality and service. Our team of experienced sales staff, account managers, planners/schedulers and technical support engineers are always ready to ensure that all of your needs are met and keep you ahead of your competition.

2.PCB Design Optimization and Manufacturing Solutions

--PCB Types and Applications:

1.Single and surface mount

Designs to support thru hole and surface mount. Normally used in automotive industry.

2.Double-sided PCB

Mixed technology circuitry supporting SMT and thru hole.

3.Aluminium Clad PCB

Typically use thermal dielectric materials bonded to an aluminum core for highly efficient dissipation of heat to cool components and increase the overall performance of products. LED PCBs are the most common usage.

4.Multilayer PCB

Up to 64 layer PCBs for High speed advanced designs.

5.HDI PCB

High Density Interconnect using laser drilled microvias up to 4-N-4

6.Back Panel PCB

Larger and thicker than normal PCBs often with press fit connectors. Used in Telecommunications as backbone interconnections.

7.Flexible PCB

Usually made using polymide (Kapton) materials, these are single, double and multilayer(upto8 layers) PCB.

8.Semi Flex PCB

Rigid PCBs with bend areas milled down to make it very thin. They are meant to be bent on installation and not flex afterwards. A much cheaper alternative to PI flex and rigid flex.

9.Rigid Flex

Hybrid of Rigid and flex PCBs. The rigid portions are connected by flex imbedded in the inner layers. Although more expensive than rigid PCBs connected by flexible cables, connectors and discrete wiring, they have higher reliability connections.

10.Heavy Copper

Rigid PCBs, uses upto 12oz copper layers. Typically used in high power transmission applications.

11.Thermal PCB

Aluminium PCBs and embedded copper layers for highly efficient dissipation of heat to cool components and increase the overall performance of devices.

12.RF/Microwave PCB

Applications that typically require laminates with specialized electrical, thermal, mechanical, or other performance characteristics that exceed those of traditional standard FR-4. Used for signals that are 5 GHz and higher. Typically using PTFE (Teflon) materials.

--PCB Surface and Finishes

1.Immersion Silver(ImAg)

Immersion Silver is a good alternative to Electroless Nickel/ Immersion Gold (ENIG) for fine pitch applications due to the lower cost.  This finish is becoming a standard in the industry and works well in lead-free processing.  Surface preparation is available in polish or etch, it is important to note that polish should be used for micro technology and etch for all others. NOTE: This finish is not backwards compatible with leaded processing and should NOT be selected for applications which will switch between leaded and lead-free.

2.Electroless Nickel/Immersion Gold(ENIG)

ENIG is a long proven industry standard and is readily available from most PCB fabricators.  This finish is suitable for almost any lead-free application regardless of complexity; however is the highest cost finish.  This finish is backwards compatible with both leaded and lead-free processing.

3.Organic Solderability Preservatives(OSP)

OSP is one of the PCB surface finishes, means Organic Solderability Preservatives, which is applied upon the bare copper to prevent PCB from being oxidized. OSP is RoHS compliant and can be quickly removed in the PCB assembly processing.

4.Immersion Tin

Immersion tin is a lead-free surface finish, which is excellent for small components. It is very thin and flat; it is perfect for Fine Pitch Technology (FTP).

5.Hot Air Solder Leveling(Hasl)

Hot air solder leveling (HASL) is a widely used PCB surface finish. It is inexpensive and easily available. It also offers a high solderability finish, making it a dominant player in the market for several years. Due to the RoHS directive, there is a major transition from HASL to lead-free HASL.

6.Flash Gold

Soft gold PCB surface finish that is very well suited to wire bonding operations. The soft gold used in this process can easily form strong metallic bonds with standard copper traces and wires. The strong bond of gold and copper allows for more conductive connections when leads are soldered to the board during the PCB Assembly Process.

7.Palladium

ENEPIG is the best surface finish that resists corrosion and reaction with air. It has a longer shelf life, which makes it the best of all.

8.Hard Gold

Plated Gold surface finish is also known as Hard Gold surface finish. It’s an expensive surface finish that uses a layer of gold on the PCB. It’s done through electroplating, and a hard layer of gold is attached to the surface of the copper. The adhesion between the PCB and the layer is firm, which increases the durability of the board.

9.Soft Gold

Soft gold PCB surface finish that is very well suited to wire bonding operations. The soft gold used in this process can easily form strong metallic bonds with standard copper traces and wires.

Pre-production Engineering

1.DFF

Design for Fabrication (DFF) is intended to help review customers' designs with respect to PCB manufacturability as early in the design cycle as possible.

2.Schematics

electrical diagram of the PCB Board.

3.DFM review

Design for Manufacturing to improve yields in the assembly process.

4.PCB stackup

Increase the density by using smaller components to reduce overall size of the PCB

5.Impedance Analysis

Controlling the time it takes for signals to get from one point to another by controlling line with and distance to a copper plane layer.

Know more click at here:10 PCB manufacturing costs